Vertiv Expands Liquid Cooling for AI and High-Performance Computing
Vertiv today announced it is expanding its CoolChip CDU (coolant distribution units) family. The company is launching three new models – the CoolChip CDU 70, CoolChip CDU 100, and CoolChip CDU 600 – in Europe, the Middle East, and Africa (EMEA). These direct-to-chip (DTC) liquid cooling solutions are designed to support AI and high-performance computing (HPC) infrastructure. The CoolChip CDU 600 is being shown for the first time in EMEA at the Vertiv booth at Datacloud Global Congress this week in Cannes.
These new units are built for both existing data centers and new constructions. They come in configurations that fit within racks or along rows, using either liquid-to-air or liquid-to-liquid cooling technologies. The systems aim to provide a flexible way to handle increasing capacity needs and encourage wider adoption of liquid cooling.
The CoolChip CDU family is part of Vertiv’s broader liquid cooling product line and its 360AI portfolio, which includes power, cooling, and services for AI deployments. These liquid cooling products are supported by Vertiv Liquid Cooling Services, an offering that covers design, installation, maintenance, and fluid management. This allows the systems to be used in various situations, from upgrading current facilities to supporting large AI and HPC clusters in new builds.
New CoolChip CDU Models:
- CoolChip CDU 70: This in-row, liquid-to-air coolant distribution unit offers up to 70 kW of cooling. It’s designed for quick and cost-effective integration into existing data centers or new setups, using current thermal infrastructure without major changes. It includes a controller for real-time monitoring and coordinated performance.
- CoolChip CDU 100: This unit provides 100 kW of liquid-to-liquid cooling in a 4U rack-mounted form factor. It allows data centers to add or expand liquid cooling one rack at a time, suitable for incremental growth or AI pilot programs. It features a heat exchanger for efficient heat transfer, an integrated controller for monitoring, and includes fluid filtration and precise temperature control (within ±1°C). It also separates facility and IT fluid loops for secure management.
- CoolChip CDU 600: An in-row, liquid-to-liquid model, this 600 kW system offers high-capacity liquid cooling for large AI and HPC deployments. It’s designed for hyperscale and colocation environments, fitting into raised floor or retrofit installations. Features include redundant pumps, advanced monitoring, and flexible piping options to simplify planning and speed up deployment.
