KIOXIA Europe has announced the expansion of its high-capacity KIOXIA LC9 Series enterprise SSD lineup with the introduction of the industry’s first 245.76 terabyte (TB) NVMe SSD. Available in 2.5-inch and Enterprise and Datacenter Standard Form Factor (EDSFF) E3.L, this new SSD is specifically engineered to meet the demanding performance and efficiency requirements of generative AI environments. This new capacity option complements the previously announced 122.88 TB (2.5-inch) model.
Generative AI workloads, which include storing vast datasets for training large language models (LLMs) and creating embeddings and vector databases for retrieval augmented generation (RAG, require storage solutions that offer immense capacity, high speed, and exceptional power efficiency.
The KIOXIA LC9 Series SSDs address these needs by featuring a 32-die stack of 2 terabit (Tb) BiCS FLASH QLC 3D flash memory combined with innovative CBA (CMOS directly Bonded to Array) technology. This advanced memory architecture and CBA technology enable an 8TB capacity in a small 154 BGA package, which KIOXIA states is also an industry first. This achievement was made possible through advancements in KIOXIA’s high-precision wafer processing, material design, and wire bonding technologies.
These SSDs are well-suited for data lakes that demand massive data ingestion and rapid processing. Unlike traditional hard disk drives (HDDs), which can create performance bottlenecks and underutilize costly GPUs, KIOXIA LC9 Series SSDs provide dense storage in a compact footprint. By offering up to 245.76 TB per drive, they can replace multiple power-intensive HDDs, leading to superior performance, reduced overall power consumption, fewer drive slots utilized, and more efficient cooling, ultimately lowering the total cost of ownership (TCO) significantly.
Key features of the KIOXIA LC9 Series SSDs include capacities of up to 245.76 TB in 2.5-inch and E3.L form factors, with up to 122.88 TB also available in 2.5-inch and E3.S form factors. They are designed to PCIe 5.0, NVMe 2.0, and NVMe-MI 1.2c specifications , and support Open Compute Project (OCP) Datacenter NVMe SSD specification v2.5. The drives also feature Flexible Data Placement (FDP) support to minimize write amplification and extend SSD lifespan , along with security options such as SIE, SED, and FIPS SED. Notably, the LC9 Series SSDs incorporate the CNSA 2.0 signing algorithm, developed with future quantum security standards in mind.
“We continue to drive innovation with the new KIOXIA LC9 Series, providing cutting-edge technology that enables our data center and hyperscaler customers to stay ahead,” said Paul Rowan, VP & CMO at KIOXIA Europe GmbH. “The 32-die stack of 2 terabit (Tb) BiCS FLASH™ QLC 3D flash memory coupled with our innovative CBA technology and the E3.L form factor within the LC9 Series SSDs address their unique requirements of Generative AI applications for speed, scale and efficiency.”
KIOXIA LC9 Series SSDs are currently sampling to select customers and will be showcased at the Future of Memory and Storage 2025 conference, scheduled for August 5–7 in Santa Clara.
